George Pan

Pan_GeorgeWEBProfessor
ASU Directory Profile

GWC 318
480-965-1732
george.pan@asu.edu

Research expertise
Computational electromagnetics, high-speed electronics packaging, magnetic resonant imaging RF coil design and analysis, inverse scattering, rough surface scattering, millimeter-wave antenna systems

George Pan joined the ASU faculty in 1995 as a professor and the director of the Electronic Packaging Laboratory. He has written three book chapters, published 68 research articles in refereed journals and presented 108 papers at national/international conferences. He has offered short courses on wavelets in electromagnetics at Moscow State University, Russia, the University of Canterbury, New Zealand, CSIRO in Sydney, Australia, IEEE Microwave Symposium, Peking University, the Chinese Aerospace Institute, the Electric Performance of Electronic Packaging (EPEP), Beijing University of Aeronautics and Astronautics, and National Central University of ROC.  His book Wavelets in Electromagnetics and Device Modeling (©2003), was among John Wiley’s best-selling titles.  He is an associate editor of the IEEE Transactions on Antennas and Propagation, and associate editor of the International Journal of Computational Electronics.

Professional preparation
Ph.D., University of Kansas

Recognition and awards
Outstanding Paper Award
Government Microcircuit Applications Conference, Nov. 1990.

Professional associations
IET Fellow
IEEE Senior Member

Selected Publications
J. Griffith and G. Pan, “Time Harmonic Fields Produced by Circular Current Loops,” IEEE Trans. Magnetics, vol. 47, no. 8, pp. 2029-2033, August 2011.

Z. Guo, G. Pan and H. Pan, ”Unified Formulation for Multiple Vias with or without Circular Pads in High Speed Interconnects,” IEEE Trans. Advanced Packaging., vol. 1, no. 8, pp. 1226-1233, August  2011.

Z. Huang, G. Pan and H. Pan, “Perfect Plane Injection for Crank-Nicholson Time-Domain Method,”  IET Microw. Antennas Propag., vol. 4, iss. 11, pp. 1855-1862, Nov. 2010.

Z. Guo and G. Pan, “On Simplified Fast Modal Analysis for Through Silicon Vias in Layered Media Based Upon Full-Wave Solutions,” IEEE Transactions on Advanced Packaging, vol. 33, no. 2, pp. 517-523, May 2010.